Mijing K29 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11

Description

1. The PCB repair platform uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
2. The PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate.
3. The PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by laser technology.
4. The PCB repair platform added motherboard layer separation and positioning installation structure.
5. Designed with precision positioning column, it will makes efficient repairs for separating, soldering and installation.
6. Pure copper heat conduction material are dealt with special process so that surface color will keep new.
7.Apply imported synthetic stone materials, a number of testing and improved precision processing with 500 degree high temperature direct heating, durable and no deformation