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QIANLI For iPhone 11 Middle Frame Reballing Stencil Platform Jig Fixture
Item IP110064
Warehouse: CN
Lead time: Item will be ready for ship between 13 May and 14 May 2025
Description
1. Used to locate and relocate mobile phone PCB BGA parts
2. Conveniently and quickly re-bombard the BGA without causing any damage, providing a solution for iPhone 11 BGA repositioning and repair
3. Strong magnetic adsorption, simple operation
4. The stencil will not deform under high temperature
5. Fast and convenient soldering
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