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Mijing A14 3D BGA Stencil IC Solder Reball Tin Plant Net for iPhone 12 Series
Item SPT0345
Warehouse: CN
Lead time: Item will be ready for ship between 24 Dec and 25 Dec 2024
Description
1. This 3D stencil is easy to use no matter you are a new or expert.
2. High success rate of planting tin,the solder balls can be formed once after you are proficient.
3. This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
4. The square holes design makes it easier to take out the formed solder balls.
5. Professional and practical, compact and portable.
