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Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max
Item SPT0139
Warehouse: CN
Lead time: Item will be ready for ship between 20 May and 22 May 2024
Description
1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design
