1. Unique edge-sealing insulation design, make the middle layer of tin reach the melting point quickly.
2. Efficient and non-destructive layering and bonding.
3. Suitable for iPhone X / XS / XS MAX / 11 / 11 Pro / 11 Pro MAX / 12 / 12 Pro / 12 Pro Max / 12 Mini.
4. Special used for layering bonding of double-layer motherboards.
5. Host-free air gun-free soldering iron-free, fast and accurate layering in three minutes, fits and does not damage the motherboard.
6. The device supports plug and play and disassembly, makes your work more efficient and saves time, meets your requirements.
7. Preheating Temperature: 180-190 celsius.