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BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11
Item TBD04266910
Warehouse: CN
Lead time: Item will be ready for ship between 25 Apr and 26 Apr 2025
Description
1. Fast and stable, precise positioning
2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.
3. Assist professionals to carry out BGA tin planting in a convenient and safe way.
4. For iPhone A11
5. The strength is more durable and not deformed
6. Dimensions: 85 x 85 x 15mm
7. Weight: 376 grams
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