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For Qualcomm PM MTK MT-Power iC Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate
Item EDA004463012
Warehouse: CN
Lead time: Item will be ready for ship between 12 Jun and 13 Jun 2024
Description
1. High temperature resistance, fast and convenient
2. This stencil is easy to use no matter you are a new or expert.
3. Precise position
4. This product is small and strong
5. High success rate of planting tin,the solder balls can be formed once after you are proficient
