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Plant Tin Plate Mesh BGA Stencil for iPhone XR / XS / Max
Item SP1572
Warehouse: CN
Lead time: Item will be ready for ship between 10 May and 12 May 2024
Description
1. Stepped groove design enables stencil to align with tinning position of IC rapidly.
2. The unique holes design makes it easier to take out the formed solder balls.
3. This stencil is easy to use no matter you are a new or expert.
4. For iPhone XR / XS / Max
