1. The internal chip integrated packaging technology is adopted to ...
1. No need to format plug and play (Note: the ...
1. The internal chip integrated packaging technology is adopted to ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
Product parameters:
1. Interface: USB 3.1
2. Material: Plastic ...
1. The internal chip integrated packaging technology is adopted to ...