1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Stable main control circuit + high-speed FLASH chip, data is ...
1. Material: Metal
2. According to the transfer rate: 25 ...
Product parameters:
1. Interface: USB 3.1
2. Material: Plastic ...
1. The internal chip integrated packaging technology is adopted to ...
1. The internal chip integrated packaging technology is adopted to ...
1. The internal chip integrated packaging technology is adopted to ...
1. The internal chip integrated packaging technology is adopted to ...
1. Material: zinc alloy
2. Interface type: USB 3.2 ...
1. The internal chip integrated packaging technology is adopted to ...
1. The internal chip integrated packaging technology is adopted to ...
1. The internal chip integrated packaging technology is adopted to ...
1. The internal chip integrated packaging technology is adopted to ...
1. Metal texture, light and durable
2. USB3.0 high-speed ...