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Mechanic iBGA 13 BGA Reballing Stencil Platform for iPhone 13~13 Pro Max
Item SPT0523
Warehouse: CN
Lead time: Item will be ready for ship between 14 May and 16 May 2024
Description
1. Anti-leakage tin barrier design
2. High temperature does not allow the drum
3. Strong magnetic automatic positioning, precision positioning
4. Integrated, removable tin planting
5. Positioning slot of the double-sided motherboard
6. For iPhone 13/13mini/13 Pro/13 Pro Max
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