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BEST BST-082 4 in 1 Tin Planting Table CPU Positioning BGA Soldering Repair Stencil For iPhone 13 Series
Item SPT0541
Warehouse: CN
Lead time: Item will be ready for ship between 28 Dec and 30 Dec 2024
Description
1. Semi-etching process
2. Cooling hole desian
3. Square hole, precise alignment
4.The rounded square and precise hole position make the tin ball more rounded and prevents the mesh from jamming the tin ball
5. High temperature resistant, not easy to deform, non-sticky, easy to get off the net
