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RELIFE RL-101H 2 In 1 Motherboard Middle Layer Blade Cell Phone Removal CPU Tool
Item TBD0605757501
Warehouse: CN
Lead time: Item will be ready for ship between 03 Jul and 04 Jul 2025
Description
1. The blade is forged from high toughness alloy steel, refined by high temperature quenching up to 8 times, with high efficient balance of hardness and toughness
2. The blade body is hardened, the edge is ultra-thin, and the design structure of the blade edge is more suitable for the requirements of use
3. Full toughness, zero damage to the motherboard chip, so that the cell phone chip to get better protection
4. Beveled layered blade: 30 degrees beveled design, thin blade hard, layered maintenance efficiency
5. Right-angle layering blade: thin edge, hard body, special technology forging many times, uniform elastic force
6. Weight: about 1g
7. Size: about 4.5 x 1.1cm
